论文总字数：14628字

摘 要

覆铜板（简称为CCL ，英文名Copper Clad Laminate），对覆铜板进行腐蚀工艺处理可以制造PCB。它是电子工业的基础材料，广泛用于仪器和电子通信中。电子技术的发展，如低功耗，高集成度，为了满足现在技术信息产业快速发展的迫切要求，这样的材料应具有高的机械性能和优异的可制造性，高的剥离强度低介电损耗，低介电常数。移动通信技术诞生于1980年代。经过几十年的发展，它已经成为连接人类社会的基本网络信息。经历了第一代到第四代移动通讯技术的发展现在已经到了第五代移动技术。5G对社会发展有很大贡献，智能社会、万物互联以及改变人们生活方式的自动驾驶的需求越来越近。第五代通信技术，将给社会带来很大的便捷，智能化港口、全息影像、远程手术、低时延传输都得依靠5G来实施。因为4G用户越来越多，低频段越来越挤，所以5G的频率选在高频，即毫米波，但是频率越高，波长就越短，带来的缺陷就是绕过建筑物的能力下降。不能越过较大的建筑物，从而导致信号的抗干扰能力差在传播过程中。因此，与4G基站数量相比，5G通信基站的铺设密度应提高一定数量级，以确保5G信号的强度和信号传输的稳定性。同时，5G通信对覆铜板的材料也提出了更严格的要求。传统的FR-4覆铜板已经不能满足需求，因此高频覆铜板应运而生，对高频覆铜板性能改善也尤为重要。本文将在聚四氟乙烯中掺杂FEP来改善高频覆铜板性能。本课题主要工作如下：

1.利用磁力搅拌器调制原材料溶液(PTFE聚四氟乙烯和FEP的混合物)。

2.利用手动上胶对玻纤布进行均匀上胶。

3.利用真空热压机对成型的半固化片进行热压。

4.利用剥离强度测试仪和矢量网络分析仪得到覆铜板的部分重要电学和物理参数。

5.利用Origin软件进行数据处理，以图片形式给出不同掺杂实验条件下的覆铜板剥离强度、介电常数、介电损耗和FEP掺杂及不同实验常量参量的关系。

关键词：高频覆铜板 聚四氟乙烯 全氟乙烯丙烯共聚物 介电常数 介电损耗

ABSTRACT

Copper Clad Laminate (CCL) is used to manufacture printed circuit boards (PCB) after etching process. It is the basic material of the electronics industry and is broadly used in instruments. The development of electronic technology, such as low power consumption and high integration, in order to meet the urgent requirements of technical information industry developing so fast. Such materials have high mechanical properties and excellent manufacturability, high peel strength and low dielectric loss and low permittivity. Mobile communication technology was born in the 1980s. After decades of development, it has become the basic network information connecting human society. After experiencing the development of the 1G to 4G, it has now reached the fifth generation of mobile technology. With the rapid development of 5G, the demands of an intelligent society, the Internet of Everything, and autonomous driving that change people's lifestyles are getting closer. As a general technology, 5G will comprehensively build a key infrastructure for digital transformation of the economy and society. 5G communication technology uses the millimeter wave band. The shorter the wavelength of the electromagnetic wave, the worse its diffraction ability, and the greater the attenuation of the electromagnetic wave during the propagation process. The anti-interference ability is poor in the propagation process. Therefore, compared with the number of 4G base stations, the laying density of 5G communication base stations should be increased by a certain order of magnitude to ensure the strength of 5G signals and the stability of signal transmission. At the same time, 5G communication also come up with stricter something its need on the materials of copper clad laminates. The traditional FR-4 copper clad laminate can no longer meet the demand, so the high frequency copper clad laminate came into being, and it is also particularly important to improve the performance of the high frequency copper clad laminate. The main work of this topic is as follows:

1. Use a magnetic stirrer to prepare the raw material solution (a mixture of PTFE polytetrafluoroethylene and FEP).

2. Use manual gluing to evenly glue the glass fiber cloth.

3. Use a vacuum hot press to hot press the formed prepreg.

4. Use the intensity meter and network vector analyzer to obtain some important electrical and physical parameters of the copper clad laminate

5. Using Origin software for data processing, the relationship between the peel strength, dielectric constant, dielectric loss, FEP doping and different experimental constant parameters of the copper-clad laminate under different doping experiment conditions are given in the form of pictures.

KEYWORDS: High frequency copper clad laminatesd；PTFE ; FEP； Permittivity；Dielectric loss

目录

摘 要 I

ABSTRACT II

第一章 绪论 1

1.1 微波通讯简介 2

1.2 高频通讯简介 2

1.3 纳米材料 3

1.4 介电性能及剥离常数介绍 3

1.4.1 介电常数 3

1.4.2 介电损耗 4

1.4.3 剥离强度 4

第二章 设备、原料以及实验方法介绍 5

2.1 设备介绍 5

2.1.1 高温真空热压机 5

2.1.2 剥离强度测试仪 5

2.1.3 矢量网络分析仪 6

2.2 原料介绍 7

2.2.1 PTFE介绍 7

2.2.2 FEP介绍 8

2.2.3 铜箔介绍 8

2.3 实验方法 8

2.3.1 成品制备 8

2.3.2 参数测量 10

第三章 实验数据及处理 12

3.1 上胶次数对覆铜板参数影响 12

3.2 掺杂FEP对高频覆铜板进行改性 13

第四章 总结与展望 16

4.1 工作总结 16

4.2 未来展望 16

参考文献 17

致谢 20

绪论

通讯技术经历了1到5代的发展，从第一代的大哥大单双工传输，到第五代全双工传输，传输速度和覆盖范围都有质的飞跃，通讯技术还会继续发展，而在通讯技术背后默默付出的就是像覆铜板材料之类的基础材料。

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