论文总字数：26669字

摘 要

聚酰亚胺是一类含有酰亚胺环的高性能高分子材料，具有优异的热稳定性、机械性能及电性能，广泛应用于航空航天、汽车、微电子等高科技领域中。但由于传统的聚酰亚胺溶解性差、加工温度高，因而其应用受到了一定限制。为满足一些特殊领域的发展需求，针对功能性聚酰亚胺材料的研究和开发已成为目前最引人注目的热点之一，例如基于聚酰亚胺薄膜的具有高导热性的炭膜。

本文以聚酰亚胺（PI）薄膜为原料，通过炭化等工艺制备出表面光洁，完整的炭膜。借助TGamp;DSC、SEM、FTIR以及XRD等测试手段分析了PI薄膜在热处理过程中质量、表面形貌、化学及微晶结构的变化。研究结果表明：在炭化时，炭化温度是制得理想炭膜的关键因素。热处理温度过低会导致样品出现裂纹，褶皱甚至碎裂的情况；550℃~1000℃的温度区间，材料损失明显；随着炭化温度的

升高，薄膜的结构和组分都发生了很大的变化，碳材料的类石墨结构逐渐形成。

关键词：聚酰亚胺 聚酰亚胺薄膜 炭化 导热

Preparation of thermal Carbon Film derived from Polyimide Films by Carbonization

Abstract

Aromatic polyimides are a class of high performance polymeric materials containing imide rings, which are well-known for their excellent thermal stability, electrical and mechanical properties. They are widely used in many high technology fields, such as aerospace, automobile and microelectronics etc. However, the applications of conventional aromatic polyimides are often limited because of their poor solubility and high processing temperatures. In order to overcome these problems and meet the need of development in some special areas, more and more researches have been focused on the preparation of functional polyimides. For example, a carbon film having high thermal conductivity property derived from polyimide films.

In this paper, carbon films having smooth surface were prepared from polyimide films by carbonization in a high temperature. The variation of mass, surface morphology, chemistry structure and microcrystalline structure for the PI films during the heat treatment were analyzed using TGamp;DSC, SEM, FTIR and XRD. Results show that carbonizing temperature were the key factors which influenced the surface and performance of carbon films. Low temperature will result in bad surface and crack. The experimental results also show that the weight of films decrease about 65% in a narrow temperature range of 600℃~900℃. The structure and composition of the films had changed a lot with increased temperature, and the graphite structure was gradually formed.

Key Words: Polyimide; Polyimide Film; Carbonization; Thermal Conductivity Property

目 录

摘 要 I

Abstract II

第一章 绪论 1

1.1 聚酰亚胺概述 1

1.1.1 聚酰亚胺的发展 1

1.1.2 聚酰亚胺的性能与应用 3

1.1.3 聚酰亚胺薄膜概况及其应用进展 7

1.2 聚酰亚胺薄膜炭化的研究进展 10

1.2.1 国外聚酰亚胺薄膜炭化的研究进展 10

1.2.2 国内聚酰亚胺薄膜炭化的研究进展 12

1.3 碳材料导热性能的研究 13

1.4 炭膜的研究 15

1.5 本论文的研究意义 15

第二章 实验部分 17

2.1 聚酰亚胺薄膜制备炭膜 17

2.1.1 原料 17

2.1.2 实验设备 17

2.1.3 炭膜的制备 17

2.1.4 样品编号及工艺参数 17

2.2 样品的表征 18

第三章 结果与讨论 19

3.1 PI薄膜炭化过程中结构与性能的研究 19

3.1.1 PI薄膜炭化的TG及DSC分析 19

3.1.2 炭化温度对制品表面形貌的影响 20

3.1.3 PI薄膜炭化过程中化学结构的变化 21

3.1.4 炭化温度对炭膜微晶结构的影响 23

结 论 25

参考文献 26

致 谢 30

第一章 绪论

1.1 聚酰亚胺概述

1.1.1 聚酰亚胺的发展

聚酰亚胺（PI）是一类分子主链中含有五元酰亚胺环的高分子聚合物。根据分子结构单元的不同类型，聚酰亚胺主要分为脂肪族聚酰亚胺和芳香族聚酰亚胺，因为脂肪族聚酰亚胺实用性差，所以通常所说的聚酰亚胺是指芳香族聚酰亚胺。

图 1-1 两类聚酰亚胺的分子结构单元

Fig. 1-1 Molecular means of two types of polyimide

另外，从合成方法来分，聚酰亚胺分为3种类型：缩合型聚酰亚胺、加成型聚酰亚胺和热塑性聚酰亚胺。

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