1. 毕业设计（论文）的内容和要求

金属纳米粒子由于具有独特的化学与物理性能，如具有催化、导电、光学与磁性等优异的性能[1]，引起纳米科学与纳米技术界的极大的关注。

纳米铜在润滑、催化、热传导流体、电子材料等领域具有重要的应用价值，但是由于纳米铜的表面活性能高，很容易氧化，给纳米铜粉的大规模生产带来极大的困难，限制了纳米铜的进一步应用。

国内外研究者为了防止铜的氧化，先后采用硼酸溶液处理、磷酸盐溶液处理、以及包覆等方法进行了尝试和探索。

2. 参考文献

[1] El-Sayed M A. Some interesting properties of metals confined in time and nanometer space of different shapes[J]. Accounts of Chemical Research, 2001, 34(4): 257-264. [2] Nasibulin A G, Ahonen P P, Richard O, et al. Copper and copper oxide nanoparticle formation by chemical vapor nucleation from copper(II) acetylacetonate[J]. Journal of Nanoparticle Research, 2001, 3(5/6): 385-400. [3] Bagshaw N E. Lead alloys: Past, present and future[J]. Journal of Power Sources, 1995, 53(1): 25- 30. [4] Xu X R, Luo X J, Zhuang H R, et al. Electroless silver coating on fine copper powder and its effetes on oxidation resistanee[J]. Materials Letters, 2003, 57(24/25): 3987-3991. [5] Misev T A, Linde R V. Powder coatings teehnology: new developments at the turn of the century[J]. Progress in Organie Coatings, 1998, 34(1/3): 160-168. [6] Yoshinag H, Wada M, Sakai T, et al. Metal hydride electrodes with lamellar-type network structure[J]. Jourual of Alloys and Compounds, 1997, 253: 665-667. [7] Yoshinaga H, Arami Y, Kajit O, et al. Highly densed-MH electrode using flaky niekel powder and gas-atomized hydrogen storage alloy powder[J]. Joumal of Alloys and Compounds, 2002, 330: 846-850. [8] 马青山, 宣天鹏. 银包铜粉的制备工艺及研究进展[J]. 稀有金属快报, 2007, 26(8): 10-14. Ma Q, Xuan T. Preparation technology and study progress of silver-coated copper powder[J]. Rare Metals Letters, 2007, 26(8): 10-14. [9] 高保娇, 蒋红梅, 张忠兴. 用银氨溶液对微米级铜粉镀 银反应机理的研究[J]. 无机化学学报, 2000, 16(4): 669-674. Gao B, Jiang H, Zhang Z. Studing on reaction mechanism of silver-plating for micro copper particle[J]. Chinese Journal of Inorganic Chemistry, 2000, 16(4): 669-674. [10] Shukl S, Seal S, Rahaman Z, et al. Electroless copper coating of cenospheres using silver nitrate activator[J]. Materials Letters, 2002, 57(1): 151-156. [11] Hai H T, Ahn J G, Kim D J, et al. Developing process for coating copper particles with silver by eleetroless plating method[J]. Surface Coatings Technology, 2006, 201(6): 3788-3792. [12] Sharma R, Agarwala R C, Agarwala V. Development of copper coatings on ceramic powder by electroless technique[J]. Applied Surface Science, 2006, 252(24): 8487-8493

3. 毕业设计（论文）进程安排

2018.12-2019.2， 文献调研，开题 2019.3-2019.4，磁性铜银复合粒子的合成 2019.4-2019.5，磁性铜银复合粒子催化性能研究 2019.5-2019.6，论文撰写