登录

  • 登录
  • 忘记密码?点击找回

注册

  • 获取手机验证码 60
  • 注册

找回密码

  • 获取手机验证码60
  • 找回
毕业论文网 > 毕业论文 > 材料类 > 材料成型及控制工程 > 正文

柔性OLED器件开孔过程对热残余应力分布影响的模拟分析毕业论文

 2021-04-08 22:29:27  

摘 要

在现在这个信息化与数字化的时代,伴随着科技与文化的飞速发展,人们对于显示技术的需求不断增加,要求也不断提高。在这样的背景下,显示器件的发展与革新无疑成为了当今社会关注的重要领域之一。柔性有机电致发光器件因其可弯折的特性,受到了广泛的关注,但目前市场上常用显示面板材料的物理性能、力学性能、疲劳性能等参数尚不完整,缺乏可用于柔性OLED(Organic Light Emitting Diode)产品材料的选型设计及模拟的基础数据库,严重影响新产品的开发和上市速度。同时,对显示区域进行开孔设计,以期对热残余应力有一定的释放作用。但是开孔方案缺乏指导性的方向,因此需要搭配仿真分析,筛选和评价开孔的设计方案。

本文通过对柔性OLED器件显示区域进行开孔设计,分析开孔对器件热残余应力的影响。并从开孔大小、开孔数量、开孔形状三个方面对开孔设计进行优化,对比总结出对热残余应力相应的影响规律,优选出一种开孔方案。

研究结果表明在对器件开设矩形开孔后,关注各层热残余应力均有一定的降低。综合对关注各层热应力的影响,减小开孔大小对GE1、GE2、ILD中部的热残余应力有一定的降低作用,但效果不明显,且会使Poly中部的热残余应力产生较大的增加,因此减小开孔宽度的优化方案并不合适。

在对开孔数量的优化中,对于只保留上下矩形开孔的方案,除了Poly,其余三层的热残余应力都产生了较为可观的降低,尽管Poly层的热残余应力仍有一定的增加,但回升的情况与减小开孔宽度相比数值较小,且仅为GE1与GE2降低的一半左右。同时根据在器件中部左右两侧设置开孔的分析结果发现,其不仅对热应力的释放没有积极的作用,同时又抵消了上下两侧开孔对热应力的释放效果。

改变开孔形状为长圆形,使关注各层热残余应力都有了不同程度的增大,因此将开孔形状改为长圆形并不会对热残余应力的释放起到积极的作用。

关键词:柔性OLED;开孔设计;热残余应力;模拟分析

Abstract

In the current era of informationization and digitization, along with the rapid development of technology and culture, people's demand for display technology is increasing and the requirements are constantly improving. In this context, the development and innovation of display devices has undoubtedly become one of the important areas of concern in today's society. Flexible organic light-emitting devices have received extensive attention due to their bendable properties. However, the physical properties, mechanical properties, fatigue properties and other parameters of commonly used display panel materials on the market are still incomplete, and there is a lack of basic database for the selection, design and simulation of flexible OLED materials, which seriously affecting the development and market speed of new products. At the same time, the opening design of the display area is carried out in order to release the thermal residual stress to a certain extent. However, the opening scheme lacks a guiding direction, so it is necessary to use simulation analysis to screen and evaluate the design of the opening.

In this thesis, the effect of the opening on the thermal residual stress of flexible OLED devices is analyzed by designing the opening in the display area. The opening design is optimized from the size of the opening, the number of openings and the shape of the opening, and the corresponding influence law on thermal residual stress is summarized by comparison, so as to select an optimal opening scheme.

The results show that after the rectangular opening is opened for the device, the thermal residual stress of each concerned layer is reduced. Comprehensive attention to the impact of thermal stress in each layer, reducing the size of the hole has a certain role in reducing the thermal residual stress in the middle of GE1, GE2 and ILD, but the effect is not obvious, and the thermal residual stress in the central part of Poly will increase greatly, so the optimization scheme to reduce the opening width is not suitable.

In the optimization of the number of openings, for the scheme of retaining only the upper and lower rectangular openings, except for Poly, the thermal residual stress of the other three layers is significantly reduced. Although the thermal residual stress of the Poly layer is still increased, the rebound value is smaller than that of the reduction of the opening width, and is only about half the reduction in GE1 and GE2. At the same time, according to the analysis results of the openings on the left and right sides of the middle part of the device, it is found that it not only has no positive effect on the release of thermal stress, but also offsets the release effect of the upper and lower openings on thermal stress.

Changing the shape of the opening to an oblong shape increases the thermal residual stress of each layer to a different extent. Therefore, changing the shape of the opening to an oblong shape does not play a positive role in the release of thermal residual stress.

Key Words:Flexible OLED; Opening design; Thermal residual stress; Simulation analysis

目 录

第1章 绪论 1

1.1 课题研究背景及意义 1

1.2 显示技术的发展 2

1.2.1 CRT显示技术 2

1.2.2 LCD显示技术 2

1.2.3 OLED显示技术 3

1.3 有机电致发光显示 3

1.3.1 有机电致发光显示器件结构及工作原理 3

1.3.2 柔性有机电致发光显示器件 4

1.4 本文研究内容与研究思路 4

第2章 模拟分析模型的建立 6

2.1 器件三维模型的建立 6

2.2 模拟分析CAE文件的建立 8

2.2.1 网格划分 8

2.2.2 建立CAE文件 11

第3章 模拟结果分析与结构优化 14

3.1 结果分析 14

3.2 开孔设计与结构优化 15

3.2.1 改变开孔大小 17

3.2.2 改变开孔数量 20

3.2.3 改变开孔形状 23

第4章 结论 26

参考文献 27

致 谢 28

论文所用原材料费用一览表 29

您需要先支付 80元 才能查看全部内容!立即支付

企业微信

Copyright © 2010-2022 毕业论文网 站点地图