摘 要

随着大规模集成电路和微型元器件的不断发展，电子元件的封装和组装技术逐渐成为实现电子整机小型化和高性能的主要影响因素。Sn-Pb焊料由于熔点相对较低，会造成焊料部分熔化或凝固，同时，Pb是一种有毒的金属元素，不能满足高精度焊接封装技术的要求。含有80%Au和20%Sn（质量分数）的Au-Sn共晶合金钎料具有高熔点且免助焊剂，同时具有较高的强度、良好的导热和导电性能，优良的抗蠕变和抗疲劳性能。Au-Sn是当前替代熔点在280~360℃内的高熔点Sn-Pb合金的最佳钎料，已被广泛应用于电子封装邻域中。

Au-Sn共晶合金钎料是由脆性金属间化合物组成，其制作成本高、难以加工成为电子封装技术中所需的各种规格。作为一种新型的合金材料研制技术，快速凝固法细化铸态凝固组织，有效提高Au-Sn合金成形加工性能，能充分满足电子封装中Au-Sn焊料尺寸小、厚度薄、脆性大等要求。快速凝固法主要有双辊甩带技术和单辊快速凝固工艺。

采用自主设计的单辊快速凝固实验装置，将80%纯Au和20%纯Sn合金熔液，制备成Au-Sn共晶钎料薄带。通过对比实验分析快速凝固实验装置的溶体温度、喷嘴形状、辊轴线速度对Au-Sn钎料薄带表面质量及成形性的影响，分析实验过程中薄带成形质量不良的原因，得出单辊快速凝固装置制备Au-Sn共晶钎料薄带的最优化工艺参数。

关键词：快速凝固；单辊法；Au-Sn共晶合金；钎料薄带

Abstract

With the continuous development of large scale integrated circuit and miniature components, electronic components packaging and assembly technology gradually become to realize electronic machine main influence factors in miniaturization and high performance. Due to relatively low melting point, Pb-Sn solders will cause the solder partial melting or solidification. At the same time, Pb, which is a toxic metal elements,cannot satisfy the requirement of high precision welding packaging technology. Containing 80% Au and Sn 80% (mass fraction) of Au- Sn solder eutectic alloy has a high melting point and avoid flux, high strength, good thermal conductivity and electrical conductivity, good resistance to creep and fatigue resistance performance. Au-Sn is the replacement of melting point within 280-360℃ high melting point alloy lead the best solder, has been widely applied in the field of electronic packaging.

Au-Sn eutectic solder is consist of brittle intermetallic compound, its production cost is high, and difficult to processing become the required specifications in the electronic packaging technology. Developed as a new type of alloy materials technology, rapid solidification method is used to refine as-cast solidified structure, and improve the Au-Sn alloys forming performance, and can fully meet Au-Sn solder in the electronic packaging size small, thin thickness and large brittleness requirement. Rapid solidification method mainly has double roller with technology and single roller rapid solidification process.

Au-Sn eutectic solder, which is Composed of 80% pure Au and 20% pure Sn alloy liquid, is prepared with self-designed single-roll fast coagulation experiment. Through contrast experiment analysis experiment device of rapid solidification of melt temperature, nozzle shape and roll shaft linear velocity of the Au-Sn solder strip surface quality and the influence of the formability. And analysis of the experimental process of thin belt forming reasons of poor quality. It is concluded that the single roller rapid solidification device for the preparation of Au-Sn thin eutectic solder with the optimization of process parameters.

Key Words：Rapid solidification; Melt Spinning Processing; Au-Sn eutectic alloy solder; Solder Strip

目 录

摘 要 I

Abstract II

目 录 III

第1章 绪论 1

1.1 电子封装技术 1

1.2 电子封装钎料合金研究现状 1

1.2.1 钎焊技术 1

1.2.2 无铅化钎料 2

1.3 Au-Sn合金焊料 3

1.4 快速凝固技术 4

1.4.1 快速凝固技术简介 4

1.4.2 快速凝固常用技术 5

1.5 研究意义和内容 7

第2章 实验方案 8

2.1 合金熔炼 8

2.2 单辊快速凝固实验装置 8

2.2.1 单辊快速凝固装置研制 8

2.2.2 Au-Sn钎料薄带制备工艺参数 10

第3章 快速凝固装置工艺参数优化 13

3.1 工艺参数对Au-Sn薄带成形质量影响 13

3.1.1 工艺参数影响因素 13

3.1.2 薄带成形效果不良情况 16

3.2 工艺参数优化 17

第4章 结论 19

参考文献 20

致 谢 22

第1章 绪论

1.1 电子封装技术

21世纪以来，信息技术逐渐成为经济发展和社会进步的主要推动力，被称为人类社会的第四次工业革命。信息化的发展依靠着软件的更新、硬件的革命和可靠性工程的实施。工业技术发展高强度、高可靠度、高性能的“轻薄小”产品。随着大规模集成电路和微型元器件的不断发展，电子元件的封装和组装技术逐渐成为实现电子整机小型化和高性能的主要影响因素^[1]。

电子封装不只影响电路本身的电性能、热性能和力学性能，而且还决定着电子整机的小型化、多功能和生产成本。电子封装的主要作用有：