电子器件中芯片传热特性研究任务书
2020-07-02 22:38:33
1. 毕业设计(论文)的内容和要求
毕业论文内容: 针对芯片热量传递过程研究进行理论研究,内容如下: 1)建立芯片的传热模型,建立合理边界条件; 2)基于计算和数值模拟的结果,分析发热功率,材料,尺寸,边界条件等对芯片传热性能的影响规律,对热量传递的稳态和非稳态模型进行分析。
毕业论文要求: 查阅文献,要求中文文献20篇以上,英文文献10篇以上,了解电子器件散热器的运行原理,写文献综述,完成开题报告。
毕业论文内容条理清晰,逻辑性强,符合写作规范。
2. 参考文献
[1] V. Vivek, A.K. Sharma, C. Balaji, Interaction effects between laminar natural convection and surface radiation in tilted square and shallow enclosures, Int. J. Therm. Sci. 60 (2012) 70-84. [2] H. Wang, S. Xin, P. Le Quere, Numerical study of natural convectione surface radiation coupling in air-filled square cavities, C.R. Mecanique 334 (2006) 48-57. [3] M.M. Gonzalez, J.H. Palafox, C.A. Estrada, Numerical study of heat transfer by natural convection and surface thermal radiation in an open cavity receiver, Solar Energy 86 (2012) 1118-1128. [4] M. Rahimi, A. Sabernaeemi, Experimental study of radiation and free convection in an enclosure with a radiant ceiling heating system, Energy Build. 42(2010) 2077-2082. [5] G.V. Kuznetsov, M.A. Sheremet, Unsteady natural convection of nanofluids in an enclosure having finite thickness walls, Comput. Therm. Sci. 3 (2011) 427-443. [6] S. Ergin, Surface radiation with conduction and natural convection in a twofloor enclosure, Energy Build. 32 (2000) 57-70. [7] M.R. Rajkumar, G. Venugopal, S. Anil Lal, Natural convection with surface radiation from a planar heat generating element mounted freely in a vertical channel, Heat Mass Transfer 47 (2011) 789-805.
3. 毕业设计(论文)进程安排
1.10-3.5 文献综述、英文资料翻译 3.6-3.11 开题报告 3.12-5.15 实验及理论研究 5月1号左右中期检查 5.16-6.6 图纸绘制 6.7- 准备答辩